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OPERATING COMPANY PROFILE

DEK

 

 

DEK is the market and technology leader in precision material deposition for advanced electronic assembly, from silicon wafer level to the global Internet infrastructure. Leading electronic brands and assembly specialists world wide trust DEK’s knowledge and people to develop and deliver complete solutions to 21st Century challenges, meeting all of the technical, commercial and environmental targets that define success in the modern era.

DEK provides its customers with high-reliability equipment and machine performance upgrades, high-quality consumables under the DEK Process Support Products brand, a comprehensive Application Services portfolio including process support and optimisation, and screens and stencils designed for advanced processes. Technologies supported include laser cutting, electro-form and chemical-etch, Vector-Guard™ recyclable stencils, and high precision screens..

DEK technical, sales and marketing centres are located in the UK and throughout Europe, in North America, China and Asia Pacific. This dependable global network places expertise and capabilities close to customers, ensuring fast and efficient delivery and supporting effective partnerships that achieve consistently high-quality results. A network of independent distributors and agents further supports the organisation within these territories.

The latest range of DEK printers benefits from DEK’s rich technological heritage, which has brought breakthrough solutions to market including ProFlow® DirEKt Imaging for enhanced material control, GridLok™ tooling for high-speed setup and changeover, the Instinctiv™ menu-based graphical user interface, and Interactiv™ Internet-based process and machine support. DEK is committed to using the best-practice techniques and innovations in mechanical and electronic design, software development, human factors knowledge, multimedia and broadband Internet to continuously enhance the customer experience of owning and operating a complete DEK process solution.

In the semiconductor sector, DEK has worked intensively with selected partners to develop handling solutions for wafers and substrates, compliant with JEDEC standards. These allow large numbers of units to be processed quickly and efficiently, at high yield rates, to maximise the advantages of high-accuracy mass imaging all the way to wafer level. DEK process solutions in the advanced semiconductor arena include wafer coating, wafer bumping, die attachment, substrate bumping, transfer molding, underfilling, and encapsulation. Among DEK's fast-growing customer base are well-known semiconductor brands, as well as a significant number of non-captive packaging specialists throughout North America, China, Asia-Pacific and Europe.

The knowledge gained by continually pushing forward the leading-edge of machine vision, motion control, positioning and alignment, and stencil fabrication challenges of the chip scale packaging sector is not only driving the next generation of DEK solutions for surface mount assembly but delivering unparalleled process solutions expertise and localized enterprise level support to customers in all materials deposition, mass imaging and screen printing sectors around the world.

Locations

Switzerland
UK
Germany
France
Netherlands
Hungary
China
Singapore
Taiwan
Malaysia
Japan
India
US

 

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